- Model NO.: Eight resin tiles
- Dielectric: FR-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Insulation Materials: Epoxy Resin
- Type: Combining Rigid Circuit Board
- Material: Fiberglass Epoxy
- Mechanical Rigid: Rigid
- Base Material: Copper
- Model: PCB
SEMG PCB Fabrication:
SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techology PCB.
1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Laser Machines, Horizontal Copper plating, Horizontal Silver plating, Heavy Gold plating, Inner Finger beveling, and Automatic Appearance Inspection,etc.
2) Process Capability: Trace Width 3/3mil for volume production, 2/2mil for prototype, min.mechanical hole 0.15mm, min. laser via:0.1mm.
3) Broad product range with expertise in :
Prototype, medium and high volume production of single-side, 2L, 4L to max.28L.
Max. HDI capability (4+N+4) PCBs.
High frequency and high performance PCBs
Heavy copper PCBs (up to 12oz inner copper)
4)Certificates: ULNo.:E96016, ISO9000-, ISO/TS16949(Automative),
ISO13485 (Medical) -certified and Bellcore-compliant(Telecom).
5) Global support across different continents.